DS-UWB is a proven technology as a highly scalable, cost effective, low power solution to the variety of handheld and AC powered applications. The Forum supports this scalable technology because it provides the required quality of service and flexible data rates for emerging consumer electronic applications, including in-room video (110 Mbps at 10 meters) and handheld mobile devices (1000+ Mbps at 2 meters), at the critical cost and power points required by these applications. DS-UWB silicon has been demonstrated around the globe, including Europe, China, US and Japan, underscoring the international interest in this robust, wireless technology. It is fully compliant with US regulations and protects all existing spectrum users.
"The UWB Forum continues to grow at a rapid pace, as the industry momentum for DS-UWB escalates," said Jon Adams, Chairperson of the Interoperability and Certification Committee for the UWB Forum. "Since the last IEEE vote two months ago, DS-UWB has received FCC certification, has design wins with the world's leading module manufacturers and remains the leading candidate for the IEEE 802.15.3a standard. These milestones underscore the two-year time to market advantage that DS-UWB enjoys, which has increased the UWB Forum's broad support from a variety of silicon, software and systems, and consumer electronic companies which are looking to implement and support UWB wireless solutions in next generation designs."
Formed in February 2004, the UWB Forum is one of the fastest growing industry organizations. DS-UWB, supported by the UWB Forum, is currently the leading candidate for the new physical layer of the IEEE 802.15.3 base standard for high-speed wireless personal area networks (WPANs). UWB Forum members are fully supportive of the Medium Access Control (MAC) sublayer defined in IEEE Std 802.15.3(TM)-2003 and several members have working 802.15.3 MAC implementations demonstrating wireless 1394, video streaming, and IP-based applications. The next vote on the IEEE 802.15.3 standard will take place in Berlin, September 13-17.
To date, DS-UWB is the only commercially available UWB silicon and the only UWB silicon to receive FCC certification for communications applications. A 110 Mbps chipset solution has been announced by UWB Forum member Freescale Semiconductor. Module manufacturers Global Sun Technology, Inc. and Universal Scientific Industrial Co., Ltd. have announced products based on DS-UWB. Additionally, a number of consumer electronics companies are expected to release products based on DS-UWB in the second half of 2004.