Based on its mounting success in the small form factor PC and entry level PC markets, VIA will continue to produce the VIA C3 processor as part of its feature rich processor platform offerings. To ensure brand continuity across mobile processor offerings, the new name for the mobile version of the VIA C3 is now the VIA C3-M processor that is currently shipping in volume.
For the embedded and thin client markets where ultra low power consumption and fanless operation are essential, VIA will continue to use the VIA Eden ESP and VIA Eden-N names for processors that have a maximum thermal design power (TDP) of a mere 7W.
